Physical Vapour Deposition (PVD) system with three magnetrons

Equipment model
Kurt J. Lesker PVD 75
Made in
Use for

Physical vapour deposition system is designed for the deposition of metallic, semiconductive and oxide thin films/membranes synthesis using magnetron sputtering technique.

Technical parameters
  • 304L Stainless Steel chamber (75 L volume) with large door opening (approximately 350×600 mm) and multiple customisable ports (2.75 CF) for attachment of various additional components and feedthroughs;
  • Oil free high vacuum (up to 10-8 mbar) achievable by 1500 L/s cryopump;
  • 3-position pneumatically actuated isolation gate valve for adjustment of pumping speed during deposition process;
  • Fully integrated computer control of gas supply (two independent MFC), pumping/venting processes, pneumatic valves and safety system.
  • Three flexible head 3 inch diameter magnetrons with exchangeable target material disks. Magnetron sputtering can be position top-down or bottom-up;
  • Wide selection of power supplies for magnetrons: 500 W and 1000 W DC power supplies with additional unit to make them operate in 2-20 kHz pulsed DC mode, 300 W RF power supply;
  • Large area (approximate diameter 300 mm) and heat capacity sample holder disk;
  • Sample heater system design to heat the backside of substrate fixture and supplied with thermocouple feedback and control of temperature up to 300 °C.
Inquire about the product